Product Details
Aerospace
Vacuum Hot Pressing Process
W168-24 High-Temperature Resistant PI Isolation Film
Product Overview
W168-24 is a polyimide-based film that can withstand continuous temperatures up to 350°C and short-term temperatures up to 400°C. It is a film material used in the vacuum bag molding process for isolation and release, allowing for more uniform resin flow and assisting in the demolding process with release fabrics.
Applicable Scope
Frequently used in wet vacuum bag processes, it does not absorb excess resin from products. Suitable for most resin systems.
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